关键词: 组装技术, 贴片压力, 导电胶溢胶, 黏接强度

Abstract: Microwave circuits contain a large number of components such as chips, and the vast majority of these components are assembled by means of automatic placement. The influence of placement pressure on adhesive reliability in automatic placement process is studied. The influence of placement pressure on the overflow length of the adhesive around the bonding components, the spreading effect of the conductive adhesive at the bottom of the bonding components and the bonding strength is analyzed. The results show that within the range of experimental parameters, the higher the placement pressure, the longer the overflow length of the conductive adhesive around the bonding components, the better the spreading effect of the conductive adhesive at the bottom, and the greater the bonding strength. In the actual production process, the reliability of adhesive bonding can be ensured by increasing the placement pressure in the automatic placement process, so as to improve the overall performance of the circuit.

Key words: assembly technology, placement pressure, overflow of conductive adhesive, bonding strength