中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2024, Vol. 24 ›› Issue (11): 110403 . doi: 10.16257/j.cnki.1681-1070.2024.0161

• 材料、器件与工艺 • 上一篇    下一篇

用于Si-APD的高能注入工艺优化研究

刘祥晟,荆思诚,王晓媛,张明,陈慧蓉,潘建华,朱少立   

  1. 无锡中微晶园电子有限公司,江苏 无锡? 214035
  • 收稿日期:2024-04-29 出版日期:2024-11-25 发布日期:2024-11-25
  • 作者简介:刘祥晟(1966—),男,湖南邵阳人,学士,工程师,电子科技大学微电子电路与系统专业毕业,主要研究方向为半导体工艺研究和电子电路的开发

Optimization Study of High-Energy Implantation Process for Si-APD

LIU Xiangsheng, JING Sicheng, WANG Xiaoyuan, ZHANG Ming, CHEN Huirong, PAN Jianhua, ZHU Shaoli   

  1. Wuxi Zhongwei Microchips Co., Ltd., Wuxi 214035, China
  • Received:2024-04-29 Online:2024-11-25 Published:2024-11-25

摘要: 雪崩区注入能量对硅基雪崩光电二极管性能影响极大,大束流高能注入的工艺需求极高的设备成本。通过理论仿真计算和实验流片,调整雪崩区的注入能量和改善雪崩区的扩散时间,将注入能量从600 keV降低到390 keV,并在低成本的中束流离子注入机上对比验证。优化前后的器件性能都满足规范要求,参数上无明显差异。工艺方法简单可控,能有效降低注入设备成本,提升硅基雪崩光电二极管产能。

关键词: 雪崩光电二极管, 高能注入, 反向击穿

Abstract: The implantation energy of the avalanche region has the significant influence on the device performance in the silicon avalanche photodiodes, and the processes of high implantation energy with large beams require high facilities costs. Through theoretical simulations and experimental tape-out, while modulating the implantation energy and improving the diffusion time of the avalanche region, the implantation energy can be reduced from 600 keV to 390 keV and compared in the low cost of mid-beam ion implanter. The device performances before and after the optimizations all can reach to the standards without obvious differences in parameters. The process method is simple and controllable, which can effectively reduce the cost of equipment for ion implantation and improve the productivity of the silicon avalanche photodiode.

Key words: avalanche photodiode, high-energy implantation, reverse breakdown voltage

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