关键词: 集成电路, Sip封装, 热应力, 数值模拟, 仿真验证, 电力电子

Abstract: In recent years microsystem SiP packaging technology from the conception of micro devices to the ground, and gradually realize the improvement of process technology, until today penetrate into the information, aerospace, marine, medical and other fields, its development trend has been unstoppable. However, for microsystem SiP packaging devices, thermal mismatch caused by thermal stress is one of the most important failure causes. To analyze the thermal fitness of the device, the experimental cost is too high, and the numerical simulation technology based on finite element can not only meet the accuracy requirements, but also save time, resources and other costs, but the domestic and foreign methods for the numerical simulation of thermal stress for microsystem SiP packages are not systematic and multi-faceted comparisons and validation. Based on the above situation, in order to realize the efficient, comprehensive and accurate simulation of thermal stress for microsystem SiP package devices, and to form an accurate and instructive simulation method. This study takes a typical microsystem SiP packaging model as an example, and investigates the thermal stress simulation method of the packaging device from five aspects, namely, convergence analysis, constraint type analysis, temperature field construction analysis, welding surface analysis, and adhesive surface analysis, and finally conducts a comparative analysis in conjunction with the experiments, which ultimately results in the formation of an accurate and efficient theory of the simulation method of thermal stress of the microsystem SiP packaging device, and then guides the packaging design of the device in this field.

Key words: integrated circuits, SiP packages, thermal stress, numerical modeling, simulation verification, power electronics