中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2025, Vol. 25 ›› Issue (12): 120403 . doi: 10.16257/j.cnki.1681-1070.2025.0167

• 材料、器件与工艺 • 上一篇    下一篇

载流子存储沟槽栅双极晶体管特性研究与优化设计*

李尧1,2,谌利欢1,2,苟恒璐1,2,龙仪1,2,陈文舒1,2   

  1. 1.兰州交通大学电子与信息工程学院,兰州  730070;2. 甘肃省集成电路产业研究院,兰州  730070
  • 收稿日期:2025-03-31 出版日期:2025-12-26 发布日期:2025-12-26
  • 作者简介:李尧(1987—),男,甘肃武威人,博士,副教授,硕士生导师,主要从事功率半导体器件、有机半导体器件、光电子器件研究。

Characteristic Study and Optimization Design of Carrier Storage Trench Gate Bipolar Transistor

LI Yao1,2, SHEN Lihuan1,2, GOU Henglu1,2, LONG Yi1,2, CHEN Wenshu1,2   

  1. 1. Schoolof Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou730070, China; 2. Gansu Institute of Integrated Circuit Industry, Lanzhou 730070, China
  • Received:2025-03-31 Online:2025-12-26 Published:2025-12-26

摘要: 为了优化载流子存储沟槽栅双极晶体管(CSTBT)的性能,对CSTBT结构进行了电学特性仿真,通过Sentaurus TCAD软件对比了T-IGBT和CSTBT的击穿特性、输出特性以及关断特性,研究了CSTBT N-drift区掺杂浓度和厚度、P-base区掺杂浓度和CSL掺杂浓度对器件的击穿特性、转移特性以及输出特性的影响。结果表明,相较于T-IGBT,优化前的CSTBT的击穿电压提升了约3.4%,正向导通压降减小了约20.9%,关断损耗几乎一致;对于优化后的CSTBT,当N-drift区厚度为158 µm、N-drift区掺杂浓度为7×1013 cm-3、P-base区掺杂浓度为3×1017 cm-3、CSL掺杂浓度为1×1016 cm-3时,器件的击穿电压为1 959 V,提升了约22%;Von为1.14 V,降低了43%。

关键词: IGBT, 击穿特性, 输出特性, 转移特性, 载流子存储层, 关断损耗

Abstract: To optimize the performance of the carrier storage trench gate bipolar transistor (CSTBT), electrical characteristics of the CSTBT structure are simulated. Using Sentaurus TCAD software, the breakdown characteristics, output characteristics, and turn-off characteristics of T-IGBT and CSTBT are compared. The effects of N-drift region doping concentration and thickness, P-base region doping concentration, and CSL doping concentration on the breakdown characteristics, transfer characteristics, and output characteristics of the CSTBT are investigated. The results show that compared to the T-IGBT, the pre-optimized CSTBT exhibits about 3.4% increase in breakdown voltage, about 20.9% reduction in forward conduction voltage drop, and nearly identical turn-off losses. For the optimized CSTBT, with an N-drift region thickness of 158 µm, a N-drift region doping concentration of 7×1013 cm-3, a P-base region doping concentration of 3×1017 cm-3, and a CSL doping concentration of 1×1016 cm-3, the device achieves a breakdown voltage of 1 959 V (about 22% improvement), Von is 1.14 V (43% reduction).

Key words: IGBT, breakdown characteristic, output characteristic, transfer characteristic, carrier storage layer, turn-off loss

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