关键词: 盖板, 预制焊环, 熔覆, 点焊, 密封

Abstract: Sealing of electronic components with prefabricated solder ring covers is one of the commonly used methods for highly reliable sealing processes. Gold material occupies a central part in the cost composition of the cover plate with prefabricated Au80Sn20 solder ring. This paper discusses the optimization of the cover layer structure, the minimization of the amount of solder, and the application of base metal solder ring, combined with the improvement of production efficiency, the guarantee of the yield rate and the improvement of the material utilization rate, etc., and explores the effective path of cost reduction while improving the sealing quality and reliability, which provides a reference solution for the cost control of the hermetic sealing device.

Key words: lid, preform frame, cladding, spot welding, sealing