电子与封装
• 封装、组装与测试 • 下一篇
张勇，高彩晋，杨兴宇，任耀华
收稿日期:
修回日期:
出版日期:
发布日期:
通讯作者:
ZHANG Yong, GAO Caijin, YANG Xingyu, REN Yaohua
Received:
Revised:
Online:
Published:
摘要： 针对高温共烧陶瓷（HTCC）腔体在成型过程中易形变的普遍性问题，本文提出一种“分布预压后合体层压+内缩PET膜”的组合方法，使在面对不同腔体结构成型问题时，能够以一种通用的手段对腔体问题进行改善。同时，对预压压力和内缩距离进行了优化，有效掌握了腔体制造工艺技术，保证了腔体成型效果，腔面平面度达到20 μm以内。采用该方法制作的产品也能满足可靠性验证方面的要求，为腔体成型提供了依据。
关键词: HTCC, 腔体成型, 预压, 内缩
Abstract: Aiming at the universal problem of high-temperature co-fired ceramic cavities which are very easy to be deformed in processing. This paper puts forward a combination of distributed pre-pressing and then merging body pressure + shrinking PET film, so that in the face of the molding problems of different cavity structures. Tt is possible to improve the cavity problems by a universal means. At the same time, the pressure of pre-pressure and shrinkage distance is optimized, effectively mastering the cavity manufacturing process technology, to ensure that the cavity molding effect, cavity surface flatness of 20 μm or less. The products made by this method can also meet the requirements of reliability verification, which provides a reference for the cavity molding.
Key words: HTCC, cavity molding, distributed pre-pressing, shrinking
张勇, 高彩晋, 杨兴宇, 任耀华. HTCC腔体成型工艺改善研究[J]. 电子与封装, doi: 10.16257/j.cnki.1681-1070.2026.0051.
ZHANG Yong, GAO Caijin, YANG Xingyu, REN Yaohua. Study on the Improvement of HTCC Cavity Molding Process[J]. Electronics & Packaging, doi: 10.16257/j.cnki.1681-1070.2026.0051.
0 / / 推荐
导出引用管理器 EndNote|Reference Manager|ProCite|BibTeX|RefWorks
链接本文: https://ep.org.cn/CN/10.16257/j.cnki.1681-1070.2026.0051
