关键词: HTCC, 外壳, 收发组件

Abstract: This paper introduced a HTCC package for dual channel T/R Module. In terms of the microwave signal transmission, the RF transmission channels were designed by using HFSS software. The Package’s transmission port and the transmission line were optimized by using the methods of hole optimization and impedance matching to improve the microwave characteristics. The test results showed that the insertion loss of RF ports and 3D transmission lines were less than 0.30 dB in the range of 10 MHz-8 GHz. In the design of packag's structure, the welded joints were optimized by the Abaqus software. The test results showed that the flatness of the package after high temperature brazing were less than 1.8μm/mm.

Key words: HTCC, ceramicpackage, T/Rmodule