中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装

• 封装、组装与测试 •    下一篇

随机振动下QFP封装加固方式的可靠性研究

郭智鹏1,李佳聪2,张少华2,何文多2   

  1. 1. 西安恒翔控制技术有限公司,西安 710071;2. 中国航空工业集团西安飞行自动控制研究所,西安 710071
  • 收稿日期:2025-03-13 修回日期:2025-03-28 出版日期:2025-04-25 发布日期:2025-04-25
  • 通讯作者: 何文多

Research on the Reliability of QFP Package Reinforcement Method Under Random Vibration

GUO Zhipeng1, LI Jiacong2, ZHANG Shaohua2, HE Wenduo2   

  1. 1. Xi´an Hengxiang Control Technology Co., Ltd., Xi´an 710071, China; 2. AVIC Xi´an Flight Automatic Control Research Institute, Xi´an 710071, China
  • Received:2025-03-13 Revised:2025-03-28 Online:2025-04-25 Published:2025-04-25

摘要: 针对QFP封装在随机振动环境中的可靠性问题,对底部填充、四角加固、底部填充结合四角加固三种加固方式进行有限元分析,结合引脚的S-N疲劳曲线计算随机振动寿命预测,分析了不同加固方式对封装器件引脚的应力分布及失效规律。研究表明:底部填充、底部填充结合四角加固两种方式器件边角位置引脚的一次成型处最容易失效,四角加固器件中间位置引脚的一次成型处应力集中显著;器件不加固,四角加固、底部填充、底部填充结合四角加固引脚寿命分别为3.23×103、3.15×106、4.33×108、2.87×1012次,3种加固方式都可以提高引脚寿命;底部填充的效果优于四角加固;底部填充且四角加固的加固方式可以极大地提高引脚寿命。

关键词: 随机振动, 引脚, 寿命预测, 底部填充, 可靠性

Abstract: In order to solve the reliability problem of QFP package in random vibration environment, the finite element analysis of three reinforcement methods, namely underfill, corner reinforcement, and underfill combined with corner reinforcement, combined with the S-N fatigue curve of the pin, calculated the random vibration life prediction, and analyzed the stress distribution and failure law of the pin of the package device by different reinforcement methods. The results show that the primary molding part of the corner position of the device is the most likely to fail in the two methods of underfilling, underfilling and four-corner reinforcement, and the stress concentration at the one-time molding place of the middle position of the four-corner reinforcement device is significant. The device is not ruggedized, and the pin life of the four corners reinforcement, underfilling, and underfilling combined with the four corners reinforcement is 3.23×103, 3.15×106, 4.33×108, 2.87×1012 cycles, respectively, and the three reinforcement methods can improve the pin life. The effect of underfill is better than that of corner reinforcement; Underfill and corner reinforcement can greatly improve pin life.

Key words: random vibration, pin, life prediction, bottom filling, reliability