关键词: 射频芯片, 互联结构, 近场耦合, 信号完整性

Abstract: In high-reliability ceramic packaging technology for radio frequency (RF) chips, the parasitic capacitance and inductance generated by interconnect structures, such as bonding wires, vias and microbumps, can cause near-field coupling of RF signals. This directly compromises the integrity of the signals during transmission. Integrating microwave network cascading theory with field-path analysis methodologies and employing three-dimensional electromagnetic simulation software (HFSS) enables modelling of RF chip packaging interconnect structures and simulation of signal integrity of transmission links based on ceramic substrates and hybrid integration processes. This approach can inform the design and optimisation of packaging process parameters, providing an efficient, standardised RF chip packaging solution. It is also significant for improving the electrical performance metrics of RF chips after packaging.

Key words: radio frequency(RF), chips, interconnect structures, near-field coupling, signal integrity