关键词:  UV膜, Die Bond, 紫外光解胶, 工艺优化

Abstract: This paper conducts an in-depth investigation into issues arising during the die bonding process for semiconductor chips, specifically the decomposition and peeling of UV-cured films, as well as chip contamination caused by excessive UV exposure time during the UV-cured adhesive release process for certain products. The problem manifests as visible adhesive residue on the chip surface after pickup, resulting in severe surface contamination, subsequent difficulties in wire bonding (WB) operations, and reduced product yield. Through systematic analysis, we identified excessive UV exposure time as the primary cause of over-crosslinking degradation and loss of cohesive strength in the UV film. This study employed Design of Experiments (DOE) methodology to optimize UV irradiation energy and exposure window duration. Concurrent adjustments to the placement machine's stylus height and lifting speed ensured uniform, efficient film removal with minimal mechanical stress. Experimental results demonstrate that the optimized process successfully eliminated UV film detachment and contamination. Post-peel surface cleanliness of the chips significantly improved while maintaining pick-up efficiency and placement yield, providing an effective process solution for high-reliability packaging production.

Key words: UV film, die bond, UV-curable adhesive, process optimization