关键词: 先进封装, 临时键合, 翘曲, 衬底选择, 工艺解决方案

Abstract: In the field of advanced packaging, including key processes such as wafer thinning, wafer-level packaging, three-dimensional packaging, backside wafer processing, and wafer reconfiguration in multi-chip package bodies, temporary bonding technology plays a crucial role. This study conducts an in-depth analysis of the warpage caused by this technology in different packaging processes, dielectric types, and wafer sizes, and proposes solutions, including the optimization of substrates and temporary bonding adhesives, optimization of spin coating processes, and adjustment of bonding parameters, to meet the demand for low-warpage temporary bonding processes in advanced packaging.

Key words: advanced packaging, temporary bonding, warpage, substrate selection, process solutions