中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装

• 封装、组装与测试 •    下一篇

面向高性能HTCC的氧化铝材料设计:从晶型选择到多因素耦合调控

王一川,周万丰,刘杰,王明明,李峰,马涛   

  1. 中国电子科技集团公司第四十三研究所,合肥  230088
  • 收稿日期:2026-02-10 修回日期:2026-04-26 出版日期:2026-04-29 发布日期:2026-04-29
  • 通讯作者: 王一川
  • 基金资助:
    共烧陶瓷基板材料(1GWZ2326033)

Design of Alumina Materials for High-Performance HTCC: From Crystal Type Selection to Multi-Factor Coupling Regulation

WANG Yichuan, ZHOU Wanfeng, LIU Jie, WANG Mingming, LI Feng, MA Tao   

  1. China Electronics Technology Group Corporation No. 43 Research Institute, Hefei 230088, China
  • Received:2026-02-10 Revised:2026-04-26 Online:2026-04-29 Published:2026-04-29

摘要: 高温共烧陶瓷(HTCC)技术作为现代微电子封装与高功率电子系统的关键技术,其性能优化一直是材料科学领域的研究重点。传统氧化铝HTCC研究多将氧化铝视为均一的α相材料,重点关注其纯度与粒度分布,而相对忽视了氧化铝多型性对最终陶瓷性能的深刻影响。氧化铝的晶体结构、物理形态与化学组成,构成了一个可系统调控的多维参数体系,这三者相互关联、协同作用,从根本上主导着HTCC的制备过程与最终性能。该文系统阐述这三个维度的特性及其对HTCC工艺的影响,深入剖析氧化铝不同类型通过烧结动力学、相变路径和微观结构演化对HTCC介电性能、热机械性能及共烧兼容性的耦合作用机制。文章指出从“单一参数优化”迈向“多维度协同设计”是突破当前氧化铝HTCC性能瓶颈、满足下一代高可靠电子封装需求的必由之路,并展望了该领域面临的挑战与未来发展方向。

关键词: 氧化铝, 高温共烧陶瓷, 多维度协同机理, 微观结构, 性能调控

Abstract: High temperature co-fired ceramics (HTCC) technology, a cornerstone of modern microelectronic packaging and high-power electronic systems, has long been a focal point in materials science research driven by the imperative of performance optimization. Conventional studies on alumina-based HTCC have predominantly treated alumina as a homogeneous α-phase material, centering their investigations on parameters such as purity and particle size distribution while relatively overlooking the profound impact of alumina polymorphism on the final ceramic properties. The crystal structure, physical morphology, and chemical composition of alumina form an interconnected, systematically tunable multi-dimensional parameter system. These three dimensions interact synergistically, fundamentally governing the preparation process and ultimate performance of HTCC. This paper systematically elaborates on the characteristics of each dimension and their respective influences on HTCC processing. Through in-depth analyses of sintering kinetics, phase transformation pathways, and microstructure evolution, it further dissects the coupling mechanisms by which different alumina polymorphs regulate the dielectric properties, thermomechanical performance, and co-firing compatibility of HTCC. The study argues that transitioning from ´single-parameter optimization´ to ´multi-dimensional collaborative design´ represents the inevitable pathway to overcoming the current performance bottlenecks of alumina HTCC and satisfying the stringent requirements of next-generation high-reliability electronic packaging. Finally, the challenges and future development directions in this field are prospected.

Key words: alumina, high temperature co-fired ceramics, multi-dimensional synergistic mechanism, microstructure, performance regulation