关键词: 三维堆叠SiP, 超宽带TR组件, 幅相多功能芯片, 陶瓷封装

Abstract: This paper proposes a design of ultra-wideband multi-channel T/R module based on ceramic-packaged three-dimensional stacked system-in-package (SiP) technology. This module integrates ultra-wideband amplitude-phase multifunctional chip design, quasi-coaxial structure vertical interconnection, and ball grid array (BGA) technology, utilizing a two-layer ceramic substrate stacked structure (interconnected through BGA balls between layers) to achieve multi-channel power division and synthesis, independent beam control, low-noise reception, and power amplification and transmission functions. The results show that the module operates in the L~X band (with a frequency coverage of no less than 12 times), integrates 8 transceiving channels, and has an overall thickness of only 3 mm (excluding the bottom BGA balls); the saturated output power of a single channel for transmission is 2 W, and the noise figure of the receiving channel is ≤4 dB. This module features high integration and excellent performance, providing an effective solution for multi-channel integrated radio frequency systems.

Key words: 3D stacked SiP, ultra-wideband TR module, amplitude-phase multifunctional chip, ceramic packaging