关键词: 微波, 覆铜板, 孔隙率, 介电常数, 介电损耗

Abstract: Microwave high frequency copper clad laminate used in high frequency communication, requires small dielectric constant and dielectric loss when selecting materials. PTFE is used as the material. But PTFE does not stick to any material and has a large coefficient of thermal expansion. Mixing FEP into PTFE emulsion improves the properties of non-stick materials. Fiberglass cloth can improve the problem of large thermal expansion coefficient. But this will cause a gap between the emulsion and the glass fiber. This experimental study found that the porosity between the emulsion and the glass fiber in the pp sheet reaches a small level when the FEP content accounts for 30% of the emulsion. This experiment uses the ratio of dielectric loss (DF) and dielectric constant (DK) to represent the level of porosity. The smaller the value, the smaller the porosity.

Key words: microwave, copper clad laminate, porosity, dielectric constant, dielectric loss