关键词: 三维集成封装, TGV工艺, 石英玻璃, 激光加工, 金属化

Abstract: Facing the future high speed and high density packaging field, TGV based on glass has become the key development direction of 3D integration technology with the advantages of low loss, low material cost, small size and high density integration. TGV technology has a broad application prospect, especially in the development of high bandwidth, low loss and high frequency transmission devices such as millimeter wave antenna. The key technology of TGV via formation for quartz glass was studied in this paper. This research reports the quartz glass packaging substrate of TGV (50 μm in diameter) in quartz glass substrates (300 μm)，and signal transmission in the vertical direction was realized.

Key words: 3Dintegrationpackage, TGV, quartzglass, laserprocessing, metallization