浅谈超导量子比特封装与互连技术的研究进展

doi:10.16257/j.cnki.1681-1070.2023.0137

电子与封装 ›› 2023, Vol. 23 ›› Issue (10): 100207 . doi: 10.16257/j.cnki.1681-1070.2023.0137

浅谈超导量子比特封装与互连技术的研究进展

汪冰^1,2,刘俊夫²,秦智晗²,芮金城²,汤文明^1,2

1.合肥工业大学材料科学与工程学院，合肥 230009；2.中国电子科技集团公司第四十三研究所微系统安徽省重点实验室，合肥 230088

收稿日期:2023-02-07 出版日期:2023-10-31 发布日期:2023-10-31
作者简介:汪冰（1985—），女，安徽无为人，本科，在职硕士研究生，高级工程师，研究方向为混合集成电路领域的电子封装。

Progress in Superconducting Quantum Bit Packaging and Interconnection Technology

WANG Bing^1,2,3, LIU Junfu^2,3, QIN Zhihan^2,3, RUI Jincheng^2,3, TANG Wenming^1,2

1. Schoolof Materials Science and Engineering, Hefei University of Technology,Hefei 230009, China;2. Anhui Key Laboratory of Microsystem of China Electronics Technology Group Corporation No.43 Research Institute, Hefei 230088, China

Received:2023-02-07 Online:2023-10-31 Published:2023-10-31

摘要/Abstract

摘要： 基于超导量子电路的量子计算技术已经在退相干时间、量子态操控和读取、量子比特间可控耦合、中大规模扩展等关键技术上取得大量突破，成为构建通用量子计算机和量子模拟机最有前途的候选技术路线之一。在介绍超导量子比特原理的基础上，结合自主创新成果，对国内外超导量子比特封装与互连技术的发展进行评价，并重点探讨了超导量子比特三维集成封装解决方案以及与外部稀释制冷机测控线路的高密度互连方案，为尽快缩小与国外超导量子计算机的差距提供超导量子比特封装与互连技术支撑。

关键词: 超导量子计算机, 超导量子比特, 三维集成封装, 高密度互连

Abstract: Quantum computing technology based on superconducting quantum circuits has made significant breakthroughs in key technologies such as decoherence time, quantum state manipulation and readout, controllable coupling between quantum bits, and medium and large-scale expansion, becoming one of the most promising candidate technological routes for building universal quantum computers and quantum simulators. On the basis of introducing the principle of superconducting quantum bits, and combining with the independent innovation achievements, the development of superconducting quantum bit packaging and interconnection technologies at home and abroad is evaluated, and the solution of three-dimensional integrated packaging of superconducting quantum bits, as well as high-density interconnection schemes with external dilution refrigerators and measurement and control lines are discussed, to provide packaging and interconnecting technology support to narrow the gap between domestic and foreign superconducting quantum computers as soon as possible.

Key words: superconducting quantum computer, superconducting quantum bit, 3D packaging, high-density interconnection

中图分类号:

TN305.94

汪冰,刘俊夫,秦智晗,芮金城,汤文明. 浅谈超导量子比特封装与互连技术的研究进展[J]. 电子与封装, 2023, 23(10): 100207 .

WANG Bing, LIU Junfu, QIN Zhihan, RUI Jincheng, TANG Wenming. Progress in Superconducting Quantum Bit Packaging and Interconnection Technology[J]. Electronics & Packaging, 2023, 23(10): 100207 .

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中国电子学会电子制造与封装技术分会会刊

浅谈超导量子比特封装与互连技术的研究进展

Progress in Superconducting Quantum Bit Packaging and Interconnection Technology

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