中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (7): 070404 . doi: 10.16257/j.cnki.1681-1070.2021.0715

• 微电子制造与可靠性 • 上一篇    下一篇

ONO反熔丝器件可编程特性研究

潘福跃1;张明新1;曹利超1;刘佰清1;洪根深1;张海良1;刘国柱1,2   

  1. 1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214072;2. 东南大学电子科学与工程学院,南京 210096
  • 收稿日期:2021-01-18 出版日期:2021-07-22 发布日期:2021-07-06
  • 作者简介:潘福跃(1989—),男,山东济南人,硕士,2013年毕业于电子科技大学微电子与固体电子学院,主要研究方向为功率半导体集成电路设计、高可靠集成电路等。

Researchon Programming Characteristics of ONO Anti-fuse Devices

PAN Fuyue1, ZHANG Mingxin1, CAO Lichao1, LIU Baiqing1, HONG Genshen1, ZHANG Hailiang1, LIU Guozhu1,2   

  1. 1. The 58th Research Institute, CETC, Wuxi 214072, China;2. Southeast University, School of Electronic Science and Engineering, Nanjin 210096, China
  • Received:2021-01-18 Online:2021-07-22 Published:2021-07-06

摘要: ONO反熔丝器件具有可靠性高、抗辐射、高开关比等优异特性,一直用于抗辐射可编程逻辑器件。基于0.6 μm CMOS工艺,分别采用“AF+MOS”和“MOS+AF”集成方法成功制备了ONO反熔丝器件,研究了ONO反熔丝阵列单元编程特性、导通电阻与编程电流以及编程时间之间的关系,同时对两种典型编程通路的编程特性进行特征化表征,最后考察了反熔丝单元编程前后的电应力可靠性。研究结果表明,采用“AF+MOS”集成方法制备的ONO反熔丝器件具有优良的击穿均匀性和编程特性。

关键词: ONO, 反熔丝, 击穿电压, 导通电阻

Abstract: ONO anti-fuse devices have been widely used in programmable logic devices because of its high reliability, radiation resistance and high switching ratio. The programming characteristics of ONO anti-fuse array elements fabricated in 0.6 μm “AF+MOS” and “MOS+AF” processes are investigated. The relationship between the resistance of ONO anti-fuse devices and the programming current and time is studied. Meanwhile, two typical programming paths are characterized. Finally, the electrical stress reliability of the anti-fuse cells before and after programming is investigated. The results show that the ONO anti-fuse devices fabricated by an "AF+MOS" integration method have excellent breakdown uniformity and programming characteristics.

Key words: ONO, anti-fusedevices, breakdownvoltage, on-stateresistance

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