关键词: 芯片, 失效分析, 去层

Abstract: The requirements of chip preparation are put forward in the standards of IC inspection and failure analysis, but the operability is lacking because the corresponding operation methods are not provided. This paper analyzes the close relationship between de-layering process and physical structure as well as materials of integrated circuit, meanwhile discusses the applicability of preparation methods through reactive ion etching, mechanical grinding and chemical corrosion. Afterwards, practical cases are carried out to verify the preparation and removal of passivation layer, dielectric layer and metallization layer. Results show that various physical layers are obtained within the requirements of inspection and analysis. The proposed chip de-layering preparation method can supplement the corresponding standards, provide reference for testing institutions and users in the process of inspection and analysis, and make it operable.

Key words: chip, failureanalysis, de-layer