关键词: BT树脂, 覆铜板, 烘烤, 剥离强度, 半加成工艺

Abstract: In recent years, the semi-additive process has become a new circuit manufacturing process for printed circuit boards, but it has the problem of low peel strength between resin and copper foil. The influence of baking BT resin substrate on the peel strength after electroless Cu plating is explored through tensile testing, scanning electron microscopy, infrared spectroscopy, and X-ray photoelectron spectroscopy (XPS).The results show that the failure mode of the plate is the cohesion failure of the resin, the adhesion between the resin and the reinforcing particles decreases after baking, and the resin itself will be affected by the catalytic oxidation of copper ions, which changes the structure and reduces the strength.Through the study of the failure mechanism, it can provide improvement ideas for the semi-additive process.

Key words: BT resin, copper clad laminate, baking, peel strength, semi-additive process