中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2017, Vol. 17 ›› Issue (2): 33 -36. doi: 10.16257/j.cnki.1681-1070.2017.0022

• 微电子制造与可靠性 • 上一篇    下一篇

一种新型PTFE覆铜板的精细图形制作前处理工艺优化

赵丹,邹嘉佳,范晓春,管美章   

  1. 中国电子科技集团公司第38研究所,合肥 230088
  • 收稿日期:2016-10-13 出版日期:2017-02-20 发布日期:2017-02-20
  • 作者简介:赵丹(1983—),男,浙江东阳人,硕士,高级工程师,现就职于中国电子科技集团公司第38研究所,主要从事雷达工艺总体技术的研究。

Studies of Pretreatment Optimization of Fine Pattern Manufacture for High-Frequency PTFE Laminate

ZHAO Dan,ZOU Jiajia,FAN Xiaochun,GUAN Meizhang   

  1. China Electronics Technology Group Corporation No.38 Research Institute,Hefei 230088,China
  • Received:2016-10-13 Online:2017-02-20 Published:2017-02-20

摘要: 精细图形制作的前处理工艺对印制电路板的铜表面粗糙度影响很大。对一款新开发的PTFE覆铜板表面采取机械磨刷、喷砂研磨、化学微蚀3种前处理工艺,通过SEM及粗糙度结果分析了处理后铜面的粗化效果。结果表明,化学微蚀前处理方式有利于获得较好的铜面外观,采用相应的图形制作工艺参数可达到较好的线宽精度要求。

关键词: 高频覆铜板, 前处理, 图形制作, 粗糙度

Abstract: Pretreatment has a great impact on copper surface of printed circuit board during fine pattern manufacture process.Three types of pretreatment technologies,brush scrubbing,pumice and chemical micro-etching,are used for a novel high frequency PTFE laminate.The surface of the copper after three different pretreatments are analyzed by Scanning Electron Microscope(SEM)and Alpha-step IQ surface profiler.The results show that copper surface pretreated by chemical micro-etching is conducive to obtain better copper surface.The line width of PTFE PCB using chemical micro-etching method meets the requirement of 0.1/0.1 mm±0.020 mm.

Key words: high frequency laminate, pretreatment, pattern manufacture, roughness

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