中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2025, Vol. 25 ›› Issue (7): 070108 . doi: 10.16257/j.cnki.1681-1070.2025.0159

• “玻璃通孔技术进展和应用”专题 • 上一篇    下一篇

降低玻璃基板TGV应力的无机缓冲层方法与仿真分析*

赵泉露;赵静毅;丁善军;王启东;陈钏;于中尧   

  1. 中国科学院微电子研究所,北京  100029
  • 收稿日期:2025-06-06 出版日期:2025-08-01 发布日期:2025-08-01
  • 作者简介:赵泉露(2001—),男,吉林长春人,硕士研究生,主要研究方向为玻璃基板可靠性。

Method and Simulation Analysis of Inorganic Buffer Layer for Reducing TGV Stress in Glass Substrate

ZHAO Quanlu, ZHAO Jingyi, DING Shanjun, WANG Qidong, CHEN Chuan, YU Zhongyao   

  1. Institute of Microelectronics,Chinese Academy of Sciences, Beijing 100029, China
  • Received:2025-06-06 Online:2025-08-01 Published:2025-08-01

摘要: 玻璃基板凭借其优异的机械性能和较高的平整度等优势成为了先进封装的关键材料。提出了在玻璃基板TGV玻璃和铜之间烧结无机缓冲层的方案来降低玻璃芯板的应力,为了与后续化学镀金属化的工艺兼容,仿真分析了ZnO、TiO2、ZrO2 3种无机缓冲层对玻璃芯板应力的影响,同时探究了缓冲层厚度、玻璃芯板厚度以及TGV孔径对玻璃芯板应力的影响。结果表明,该方案相比纯铜填充的TGV可以有效降低叠层升温过程中玻璃芯板的应力,其中烧结5 μm的TiO2玻璃芯板应力降低了66.58%。同时缓冲层越厚、TGV孔径越小,玻璃基板TGV升温过程玻璃芯板的应力越小,此结果可为降低玻璃基板TGV的应力提供重要参考。

关键词: 无机缓冲层, TGV金属化, 玻璃基板, 热应力, 有限元仿真

Abstract: Glass substrate has emerged as a key material for advanced packaging due to its superior mechanical properties and high flatness. To reduce the glass core stress, a scheme of sintering an inorganic buffer layer between the TGV glass and copper on the glass substrate is proposed. To ensure compatibility with subsequent electroless metallization processes, simulation analysis is conducted to analyze the effects of three types of inorganic buffer layers, namely ZnO, TiO2, and ZrO2, on the stress distribution of the glass core. At the same time, the influences of buffer layer thickness, glass core thickness, and TGV diameter on the glass core stress are also investigated. The results show that, compared with TGV filled with pure copper, the proposed scheme can effectively reduce the stress of the glass core during the heating process in the lamination stage. Among them, the glass core stress of the sintered 5 μm TiO2 is reduced by 66.58%. At the same time, the thicker the buffer layer and the smaller the TGV diameter, the lower the glass core stress during the TGV heating process of the glass substrate. These findings can provide an important reference for reducing the stress of the glass substrate TGV.

Key words: inorganic buffer layer, TGV metallization, glass substrate, thermal stress, finite element simulation

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