平行缝焊工艺的热应力影响研究

doi:10.16257/j.cnki.1681-1070.2025.0048

电子与封装 ›› 2025, Vol. 25 ›› Issue (6): 060201 . doi: 10.16257/j.cnki.1681-1070.2025.0048

• 封装、组装与测试 • 下一篇

平行缝焊工艺的热应力影响研究

万达远，马明阳，欧彪，曹森

深圳市国微电子有限公司，广东深圳? 518057

收稿日期:2024-11-28 出版日期:2025-06-27 发布日期:2025-06-27
作者简介:万达远（1991—），男，江西上饶人，硕士，工程师，现从事器件及板级相关的封装力学仿真分析工作。

Study on the Effects of Thermal Stress in Parallel Seam Welding Process

WAN Dayuan, MA Mingyang, OU Biao, CAO Sen

Shenzhen State Microelectronics Co., Ltd., Shenzhen 518057, China

Received:2024-11-28 Online:2025-06-27 Published:2025-06-27

摘要/Abstract

摘要： 在陶瓷封装行业中，平行缝焊技术因其高可靠性和成本效益而备受青睐。然而，当工艺参数设置不当或管壳结构设计存在缺陷时，封帽过程中可能导致管壳开裂，进而影响器件的气密性。采用有限元分析方法，深入探讨了焊接过程中管壳的开裂失效机理，并分析了管壳结构尺寸和工艺参数对热应力的影响。研究结果表明，通过优化管壳结构设计和调整焊接工艺参数，管壳热应力最大可降低约28%，减少了密封开裂的风险。

关键词: 平行缝焊, 有限元, 热应力

Abstract: In the ceramic packaging industry, parallel seam welding technology is highly favored for its high reliability and cost-effectiveness. However, improper process parameter settings or deficiencies in shell structure design can lead to shell cracking during the sealing process, thereby affecting the hermeticity of the device. The failure mechanism of shell cracking during the welding process is investigated in depth by finite element analysis method, and the effects of shell structure dimensions and process parameters on thermal stress are studied. The research results indicate that the maximum thermal stress of the shell can be reduced by approximately 28% by optimizing the shell structure design and adjusting welding process parameters, thereby reducing the risk of seal cracking.

Key words: parallel seam welding, finite element, thermal stress

中图分类号:

TN305.94

万达远，马明阳，欧彪，曹森. 平行缝焊工艺的热应力影响研究[J]. 电子与封装, 2025, 25(6): 060201 .

WAN Dayuan, MA Mingyang, OU Biao, CAO Sen. Study on the Effects of Thermal Stress in Parallel Seam Welding Process[J]. Electronics & Packaging, 2025, 25(6): 060201 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

平行缝焊工艺的热应力影响研究

Study on the Effects of Thermal Stress in Parallel Seam Welding Process

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