玻璃基板技术研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0161

摘要/Abstract

摘要： 随着高性能计算和人工智能等新兴应用的迅猛发展，先进封装技术正加速演进。作为其核心支撑，高端基板技术需同时应对高速高频信号传输、功耗管理、超细节距互连及系统级集成等多重性能需求。玻璃基板凭借其优异的热机械稳定性、极低的吸湿性和卓越的电学特性，成为突破传统封装限制的关键方向。围绕玻璃基板的结构特性与关键制造工艺进行分析，重点探讨了其在可靠性方面存在的主要问题，并总结其所面临的技术机遇与挑战。

关键词: 先进封装, 玻璃基板技术, 高密度互连, 翘曲

Abstract: Advanced packaging technologies are rapidly evolving driven by the quick development of new applications like high-performance computing and artificial intelligence. High-end substrate technology is core support that must concurrently handle the multiple performance requirements, such as high-speed and high-frequency data transmission, power management, ultra-fine-pitch interconnections, and system-level integration. Glass substrates have become a key solution to overcome the limitations of traditional packaging because of their great thermomechanical durability, very low moisture absorption, and exceptional electrical qualities. The structural features and crucial production processes of glass substrates are analyzed, with a special focus on reliability concerns, and the technical opportunities and challenges they faced are summarized..

Key words: advanced packaging, glass substrate technology, high density interconnect, warpage

中图分类号:

赵瑾，于大全，秦飞. 玻璃基板技术研究进展^*[J]. 电子与封装, 2025, 25(7): 070110 .

ZHAO Jin, YU Daquan, QIN Fei. Research Progress of Glass Substrate Technology[J]. Electronics & Packaging, 2025, 25(7): 070110 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

玻璃基板技术研究进展^*

Research Progress of Glass Substrate Technology

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