关键词: 腐蚀, 铜丝键合, 预镀框架, 电位

Abstract: Corrosion is an important factor affecting reliability of copper wire bonding in plastic package of integrated circuit, which is closely related to humidity, temperature, Cl ion concentration and electric potential. In view of the corrosion failure of the second bonding point between NiPdAgAu pre-plated frame and pure copper wire, the evaluation method is studied, and the pretreatment with NaCl solution of different concentrations and the effect of potential on the corrosion results are analyzed through actual working conditions. The samples are placed in NaCl solution with concentrations of 0.5%, 2.0% and 5.0% respectively. The samples are pretreated with high temperature and high humidity for 24 h, and then they are conducted high accelerated stress test for 96 h. The results showed that the pretreatment with 5.0% NaCl solution was more effective for accelerating corrosion, and most of the corroded bonding points were located in the low electric potential pins, while a few were located in the high electric potential pins.

Key words: corrosion, copper wire bonding, pre-plated frame, electric potential