倒装芯片焊点缺陷无损检测技术

doi:10.16257/j.cnki.1681-1070.2024.0110

摘要/Abstract

摘要： 倒装芯片技术因其高封装密度和高可靠性等优势，已成为微电子封装的主要发展方向。然而，随着倒装芯片焊点尺寸和间距迅速减小，焊点往往容易出现裂纹、空洞、缺球等微缺陷，严重影响芯片性能并导致芯片失效。因此，对倒装芯片进行缺陷检测以提高电子封装的可靠性至关重要。无损检测技术作为工业领域一种重要的缺陷检测手段，已被成功应用于检测焊点缺陷，常用方法包括光学检测、热红外检测、X射线检测、超声检测、振动检测等。分别阐述了以上无损检测方法的原理及其在焊点缺陷检测领域应用的主要成果，并总结了无损检测方法的优缺点。

关键词: 倒装芯片, 焊点, 缺陷检测, 无损检测方法

Abstract: Flip chip technology has been the main development direction of microelectronics packaging due to its advantages of high packaging density and reliability. However, with the rapid reduction of solder joint size and spacing, solder joints are prone to micro-defects such as cracks, voids, missing balls, which seriously affect chip performance and lead to chip failures. Therefore, defect detection of flip chip is crucial to improve the reliability of electronic packaging. As an important defect detection method in the industrial field, non-destructive detection technology has been successfully applied to detect defects of solder joints. Common methods include optical detection, thermal infrared detection, X-ray detection, ultrasonic detection, vibration detection and so on. The principles of non-destructive detection methods and the main achievements of application in the field of defect detection of solder joints are described, and the advantages and disadvantages of non-destructive detection methods are summarized.

Key words: flip chip, solder joint, defect detection, non-destructive detection method

中图分类号:

TN407

李可;朱逸;顾杰斐;赵新维;宿磊;MichaelPecht. 倒装芯片焊点缺陷无损检测技术[J]. 电子与封装, 2024, 24(9): 090204 .

LI Ke, ZHU Yi, GU Jiefei, ZHAO Xinwei, SU Lei, Michael Pecht. Non-Destructive Detection Technology for Solder Joint Defects of Flip Chip[J]. Electronics & Packaging, 2024, 24(9): 090204 .

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