关键词: TO型, 内部水汽含量, 脱氢处理, 铅锡银焊料

Abstract: The consistency of the internal water vapor content of TO-type devices sintered with lead-tin-silver solder under the same parallel seam soldering process shows differences, and the water vapor content of some devices even exceeds the standard. Hydrogen and oxygen are present in the cavity of the screened device, and the gases undergo a chemical reaction under high temperature conditions such as reverse bias or aging, generating water vapor, and resulting in excessive water vapor content. By dehydrogenating the shell and cover plate, the hydrogen released in the sealed cavity can be significantly reduced, and the generation of water vapor can be reduced, so as to achieve the purpose of improving the consistency of water vapor content in the TO-type devices. This method can provide a technical way for controlling internal water vapor content of TO-type devices sintered with solders such as lead-tin-silver solder.

Key words: TO-type, internal water vapor content, dehydrogenation treatment, lead-tin-silver solder