关键词: 晶圆级封装, 微波变频SiP, 小型化, 多通道一致性

Abstract: With the increasingly high-density integration of semiconductor technology, system in package (SiP) has become an important technological path for achieving miniaturized microelectronic products. A small-sized microwave frequency-conversion SiP chip based on wafer-level packaging technology is proposed, which uses a reconstituted wafer formed by redistribution layers (RDLs) and polyimide dielectric layers. The chip mainly integrates microwave monolithic circuits such as a mixer, two low-noise amplifiers, and a filter, realizing the down conversion of K- and Ka-band signals to L-band. The chip size is only 6.9 mm×5.2 mm×0.5 mm. Compared with the traditional micro-assembly process, the microwave frequency-conversion SiP chip designed based on wafer-level packaging process has great advantages in multi-channel consistency.

Key words: wafer-level packaging, microwave frequency-conversion SiP, miniaturization, multi-channel consistency