关键词: 真空灌封, 电子元器件, 环氧树脂胶

Abstract: The key to enhancing the quality of electronic component potting lies in eliminating air bubbles within the potting compound. Vacuum potting is a critical method within existing processes for bubble elimination. The principles and process flow of vacuum potting technology are systematically elaborated, the characteristics of potting materials are analyzed, and a compatible metering and mixing system for the dispensing equipment is selected. Through experimental validation, a viable vacuum potting process method for electronic components is established. Surface treatment of components prior to potting and precise control of process parameters during potting are effective means of improving potting quality. Compared with traditional atmospheric pressure potting, vacuum potting effectively addresses electrical performance degradation caused by bubbles or voids in the potting of miniaturized components, enhancing electrical stability and reliability.

Key words: vacuum potting, electronic component, epoxy resin adhesive