关键词: 回流焊, 波峰焊, 印刷电路板, 表面安装技术

Abstract: Molded integrated circuits (IC) reliability issue caused by ionic contamination due to package moisture erosion is more common, which caused by solder contamination of printed circuit boards is not much. The actual case of IC reliability failure caused by printed circuit board solder contamination is introduced, the conditions for the occurrence of solder contamination is pointed out, and it is concluded that solder contamination may lead to IC reliability failure by analyzing the elemental composition of IC molding body. By heating the failed product and aging it again, the IC appears to get better and fail again. In principle, it explains that solder contamination of IC package is not recoverable and may fail again under certain conditions. Suggestions are given to SMT engineers to avoid reliability failures caused by similar solder contaminated IC.

Key words: packaging, MEMS, dispensing glue