关键词: 平面变压器, 黏接, 电源模块灌封

Abstract: The potting process in the power module is the focus in the whole module assembly process, and the planar transformer bonding is the high incidence area of failure. Through finite element simulation analysis and experimental verification, the main factors influencing bonding interface cracking failure are analyzed, including the internal stress of the bonding adhesive, the thermal stress of the internal and external potting adhesive, as well as the long-term thermal coupling creep degradation of the bonding adhesive. From the perspective of assembly process, targeted solutions are proposed. By optimizing adhesive selection, adhesive reinforcement, silicone rubber plugging process, and incorporating stress relief measures, adhesive cracking issues are effectively resolved, achieving reliable bonding of planar transformers.

Key words: planar transformer, bonding, power module potting