半导体先进封装领域专利技术综述

doi:10.16257/j.cnki.1681-1070.2026.0005

摘要/Abstract

摘要： 随着AI、高性能计算等产业的快速发展，先进封装技术成为延续摩尔定律的重要技术路径之一。聚焦2.5D与3D封装技术，系统梳理以封装结构、中介层、基板为核心的专利技术体系，剖析典型专利的创新点、技术优势及市场应用价值，揭示半导体封装测试领域的专利布局策略与产业竞争态势，为相关企业的技术研发与专利布局提供参考。

关键词: 半导体封装测试, 2.5D封装, 3D封装, 专利技术, 异构集成

Abstract: With the vigorous development of industries such as AI and high-performance computing, advanced packaging technology is now regarded as a crucial pathway for extending Moore’s Law. 2.5D and 3D packaging technologies are focused. The patent technology systems centered on packaging structures, interposers, and substrates are systematically reviewed. Furthermore, the innovation points, technical advantages, and market application values of typical patents are analyzed. The patent layout strategies and industrial competition landscape in the field of semiconductor packaging and testing are also revealed. Accordingly, guidance is provided for relevant enterprises in technology research and development as well as patent layout.

Key words: semiconductor packaging and testing, 2.5D packaging, 3D packaging, patent technology, heterogeneous integration

中图分类号:

TN305.94

余佳，马晓波. 半导体先进封装领域专利技术综述[J]. 电子与封装, 2026, 26(1): 010204 .

YU Jia, MA Xiaobo. Review on Patent Technologies in the Field of Advanced Semiconductor Packaging[J]. Electronics & Packaging, 2026, 26(1): 010204 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊