关键词: HTCC, CBGA外壳, 微波端口设计, 结构设计

Abstract: Based on the high-temperature co-fired ceramic (HTCC) process, an integrated ceramic ball grid array (CBGA) housing applied to transmitter/receiver (T/R) component packaging within 8-12 GHz is designed to achieve the miniaturization, high-integration, and low-cost requirements of component packaging. In terms of microwave port design, according to the theory of coplanar waveguide and coaxial line, HFSS software is used to simulate and optimize the microwave transmission structure, and the physical port test results show that, within the 8-12 GHz frequency range, |S₂₁| <0.2 dB and |S₁₁| >20 dB. In terms of structural design, the housing structure is optimized by using ABAQUS software to improve the dimensional design. After high-temperature brazing, flatness of the bottom spherical surface is ≤60 μm, the pull-off and shear strength of the solder balls are both ≥3.5 N, meeting the requirements for subsequent board-level applications.

Key words: HTCC, CBGA housing, microwave port design, structural design