关键词: 等离子刻蚀, 等离子划片, 刀片划片, 激光划片, 多项目圆片

Abstract: Plasma dicing is a new raised technology for wafer dicing in recent years, differing from traditional blade dicing, laser dicing and other dicing technologies, this new technology could complete the whole dicing process of all dice in one wafer synchronously, benefited with a large increasing on process efficiency. It is a disruptive technology to existing dicing process. This paper introduces the working principle, technical features and its advantages, and the typical issues in wafer dicing which are solved by plasma dicing, and its application disadvantages are also discussed.

Key words: plasma etching, plasma dicing, blade dicing, laser dicing, multi project wafer