有限元数值模拟在BGA/QFP/CCGA器件焊点可靠性研究中的应用

doi:10.16257/j.cnki.1681-1070.2020.0201

摘要/Abstract

摘要： 有限元数值模拟方法因其可以有效研究IC封装中无铅焊点的可靠性，被国内外专家学者所青睐，使得无铅焊点可靠性数值模拟成为IC封装领域的重要研究课题。综述了有限元法在球珊阵列封装（BGA）、方型扁平式封装（QFP）、陶瓷柱栅阵列封装（CCGA）3种电子器件无铅焊点可靠性方面的研究成果。浅析该领域国内外的研究现状，探究有限元方法在无铅焊点可靠性研究方面的不足及解决办法，展望无铅焊点可靠性有限元模拟的未来发展趋势，为IC封装领域无铅焊点可靠性的研究提供理论支撑。

关键词: 有限元, IC封装, 无铅焊点, 可靠性

Abstract: The finite element numerical simulation method is favored by experts and scholars at home and abroad because it can effectively study the reliability of lead-free solder joints in IC packaging, which makes the numerical simulation of lead-free solder joints become an important research topic in IC packaging field. In this paper, the research results of finite element method (FEM) on the lead-free solder joint reliability of electronic packaging such as ball grid array package (BGA), square flat package (QFP) and ceramic columnar array package (CCGA) are reviewed. This paper analyzes the research status in the IC packaging field at home and abroad, explores the deficiencies and solutions of the finite element method in the reliability study of lead-free solder joints, and looks forward to the future development trend of finite element simulation of lead-free solder joint reliability. It lays the foundation for further research in the IC packaging field of leadfree solder joint reliability.

Key words: finite element, IC packages, lead-free solder joints, reliability

中图分类号:

TN305.94

夏卓杰，张亮，熊明月，赵猛. 有限元数值模拟在BGA/QFP/CCGA器件焊点可靠性研究中的应用[J]. 电子与封装, 2020, 20(2): 020101 .

XIA Zhuojie, ZHANG Liang, XIONG Mingyue, ZHAO Meng. Application of Finite Element Numerical Simulation in the Reliability Study of LeadFree Solder Joints in BGA/QFP/CCGA Devices[J]. Electronics & Packaging, 2020, 20(2): 020101 .

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