中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (2): 020201 . doi: 10.16257/j.cnki.1681-1070.2020.0203

• 封装、组装与测试 • 上一篇    下一篇

陶瓷封装中PIND典型问题分析与处理

陈陶,张嘉欣   

  1. 无锡中微高科电子有限公司,江苏 无锡 214035
  • 收稿日期:2019-10-11 出版日期:2020-02-24 发布日期:2020-02-24
  • 作者简介:陈陶(1988—),男,江苏宜兴人,本科,工程师,毕业于苏州大学材料工程学院,现从事集成电路封装工艺、失效分析及可靠性的相关研究工作。

Analysis and Dispose of PIND Typical Issue in Ceramic Packaging

CHEN Tao, ZHANG Jiaxin   

  1. Wuxi Zhongwei High-tech Electronics Co.,Ltd., Wuxi214035, China
  • Received:2019-10-11 Online:2020-02-24 Published:2020-02-24

摘要: 结合碰撞噪声检测试验及生产实际,通过列举法,从多余物定义及检测方法、PIND检测原理、导致PIND不合格的因素、PIND不合格的预防及控制等方面,对陶瓷封装中PIND典型问题进行了分析与探讨。重点研究了封装工艺中可能引入的多余物,并给出封装设计、工艺及PIND测试等关键环节的预防及控制措施,对陶瓷封装PIND问题分析与处理有一定借鉴意义。

关键词: 陶瓷封装, 多余物, PIND典型问题

Abstract: Combined with particle impact noise detection test and producing practice, this article analyzes and disposes the PIND typical issue by using enumeration method in ceramic packaging. These methods contain the definition and test method of remainder, PIND testing principle, the factors that lead PIND fail, the prevention and control methods of PIND issue and so on. This article focuses on the remainders that may introduced from package process, and then gives out the corresponding prevention and control methods in these key processes: like design, process and PIND test and so on. It has a certain reference for the analysis and dispose of PIND issue in ceramic packaging.

Key words: ceramic packaging, remainder, PIND typical issue

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