关键词: 裸芯片, 分立, KGD, 筛选方法

Abstract: The demand for bare dies in advanced packaging products such as military SIP, MCM and Hybrid ICs is increasing.KGD after reliability screening is used to ensure the final product yield and reliability. Based on the existing domestic and foreign standards, testing equipment and inspection environment, aiming at the discreet bare dies in the KGD acquisition metnod, through temporary fixture loading/unloading of individual chips, electric aging and three-temperature testing are conducted to establish discrete bare dies. The KGD screening method and the environmental control method enable the screened bare dies to meet the grade requirement of the packaged finished products in terms of technical indicators and reliability indicators. The reliability verification of the qualified products after screening was carried out to prove that the proposed KGD screening method can obtain KGD products that meet the requirements of users.

Key words: bare die, discrete, KGD, screening method