中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2018, Vol. 18 ›› Issue (5): 1 -4. doi: 10.0.63.129/j.cnki.1681-1070.2018.0047

• 封装、组装与测试 •    下一篇

铜复合材料功率外壳钎焊失效分析与改进

谢新根,程 凯,申艳艳,李鑫   

  1. 中国电子科技集团公司第五十五研究所,南京 210016
  • 收稿日期:2017-09-12 出版日期:2018-05-20 发布日期:2018-05-20
  • 作者简介:谢新根(1986—),男,江西萍乡人,工程师,主要研究方向为封装外壳、金属零件镀覆技术及可靠性分析。

Failure Analysis and Improvement of Brazing of Copper Composite Material Power Package

XIE Xingen,CHENG Kai,SHEN Yanyan,LI Xin   

  1. China Electronics Technology Group Corporation No.55 Research Institute,Nanjing 210016,China
  • Received:2017-09-12 Online:2018-05-20 Published:2018-05-20

摘要: 通过对铜复合材料功率外壳钎焊失效案例的分析,发现国内业界在热沉加工过程中存在的不足,如采用了砂纸打磨、氧化铝喷砂等工艺,导致外壳存在可靠性隐患,也直接导致该类外壳热沉表面粗糙度大(正常为~1.6 μm,失效批次为~2.6 μm),与进口热沉表面粗糙度(~0.55 μm) 存在较大差异。如对热沉加工提出要求,热沉的表面粗糙度可改善至~0.7 μm,将大幅提升外壳的一致性和可靠性。

关键词: 金锡, 铜-钼-铜, 铜-钼铜-铜, 铜-钨铜-铜

Abstract: Through the brazing failure ofcopper composite power package,we found some shortcomings in the process of domestic heat sink,such as sandpaper grinding,alumina blasting and so on,which leads to the reliability hidden trouble of the package.It also directly causes the surface roughness of the package heat sink(the surface roughness of the normal heat sink is~1.6 μm,and the failure heat sink is~2.6 μm),which is quite different from the surface roughness of the inlet heat sink(~0.55 μm).The surface roughness of the heat sink can be improved to ~0.7 μm if the domestic heat sink processing is required.The consistency and reliability of the package willbe greatly improved.

Key words: power package, AuSn, CMC, CPC, Cu-WCu-Cu

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