中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2020, Vol. 20 ›› Issue (6): 060402 . doi: 10.16257/j.cnki.1681-1070.2020.0607

• 微电子制造与可靠性 • 上一篇    下一篇

导电胶粘接片式器件侧边胶量仿真优化与验证

李文,李阳阳,朱晨俊,赵鸣霄   

  1. 中国电子科技集团公司第二十九研究所,成都 610036
  • 接受日期:2020-03-05 出版日期:2020-06-17 发布日期:2020-03-23
  • 作者简介:李文(1991—),男,四川巴中人,硕士,毕业于华南理工大学,工程师,主要从事微组装及相关工艺技术工作。

Optimization on H20E Bonding Surface Mount Device via Simulation and Experiments

LI Wen, LI Yangyang, ZHU Chenjun, ZHAO Minxiao   

  1. The 29th Research Institute of CETC, Chengdu 610036, China
  • Accepted:2020-03-05 Online:2020-06-17 Published:2020-03-23

摘要: 导电胶常用于微波电路中的粘接互连,其互连可靠性对电路长期稳定运行至关重要。基于对某电源模块互连失效的分析,探索侧面胶量对于片式电容互连可靠性的影响。通过仿真模拟和试验分析,研究了不同侧面胶量下导电胶粘接电容在温度循环过程中的受力情况。结果表明,粘接电容侧面的导电胶胶量高度在电容高度的1/4时,其内部应力最小,互连可靠性最好。

关键词: 导电胶, 互连可靠性, 内应力, 失效分析

Abstract: Conductive adhesive is commonly used in the interconnection of components in microwave circuits, the interconnection reliability is essential for the long-term stable operation of the device. Based on the analysis of conductive adhesive interconnect failure modes in the power module, the article explores the impact of the side conductive adhesive volume on the reliability of capacitor interconnects. Through simulation and experimental analysis, the force of the side conductive adhesive bonding capacitor under different temperature is studied. The results show the internal stress is the smallest and the interconnection strength is the best, when the height of the conductive adhesive is one fourth of the height of the capacitor.

Key words: conductive adhesive, interconnection reliability, internal force, failure analysis

中图分类号: