关键词: 空腔键合, 叠层芯片, BSOB, 可靠性

Abstract: With the rapid development of electronic packaging technology,multi-stack die package has been widely applied in three-dimensional packaging integration circuit.It meets the increasing demand of high performance,light weight,low power consumption,and small scale.The article utilizes a method of sandwich stacked die package,and optimizes wire bonding processes in ceramic package.In ceramic package the bonding points and bonding wire are exposed in the cavity without molding compound.In the test,the maximum bonding wire offset length is 0.119 mm,no short-circuit failure occur and wire bonding gap is proper.

Key words: wire bonding in cavity, multi-stack die, BSOB, reliability