关键词: 封装, MCM-L, MCM-C, MCM-D

Abstract: MCM package is a multichip component，which can stack the bare chip in the Z direction, so it is more suitable for light, thin, short and small electronic products. The paper introduced three kinds of classification of MCM packaging: MCM-L,MCM-C and MCM-D. MCM-L has low cost and mature production technology, but its thermal conductivity and thermal stability are both low.MCM-C has good thermal stability and low cost, but it is hard to be made into a multilayer structure. MCM-D is the application for thin film packaging technology, it is also one of the technology of electronic packaging industry to study and develop. In the end, the latest development of MCM packaging technology in the multichip module and so on were analyzed.

Key words: packaging, MCM-L, MCM-C, MCM-D