关键词: 陶瓷柱栅阵列封装电路, 器件级可靠性评估, 返工, 高温存储, 温度循环

Abstract: Ceramic Column Grid Array (CCGA) devices have been widely used in aerospace models. CCGA devices often undergo high temperature storage and extremely cold and hot space in their application, which will result in the cracking of solder joint and finally lead to the device failure. In this paper, the reliability of CCGA devices with reinforced columns which were subjected to the thermal cycle, high-temperature storage and multiple rework of were investigated. The results show that CCGA devices did not fail after being stored at high temperature for 2000h, but broke inside the solder joint after 2000 ℃ cycles. The results of the thermal environmental reliability of the solder joints within 3 reworks were not different from those without reworks.

Key words: ceramiccolumngridarraypackage, reliabilityassessmentofdevices, re-work, high-temperaturestorage, thermalcycle