关键词: 老炼过程中测试, XR8238A, DDR3

Abstract: Burn in is the main purpose of simulating operating life of chips. Forcing biasing voltage and high temperature is to simulate the worst using environment. Burn in is used to monitor the reliability and reject the early failure from the products. It is depended on the time of burn in, the defect of premature senility or the loss of aging may result in the failure of chips. A set of printed board based on XR8238A is designed, the code pattern is written in, and the expected waveform is outputted, which efficiently completes the research of burn in test and fills the blank of MTBF test (mean time between failures). The effect of burn in test is improved greatly.

Key words: burn in test, XR8238A, DDR3, mean time between failures