关键词: 裂纹, SOT23, 塑封体

Abstract: The crack in plastic package of SOT series products is one of the common failure modes in the semiconductor packaging process, especially SOT23 plastic package crack. Due to the diversity and concealment of the cracks in the plastic package, the qualified rate of products is greatly affected and the hidden trouble in quality is caused. By analyzing the causes of the cracks and carrying out relevant experimental verification, a set of effective methods was put forward to solve the SOT23 plastic package crack at last.

Key words: crack, SOT23, plastic package