关键词: PTC元件, 电子封装, 散热能力, 仿真模拟, 发热功率

Abstract: Positive Temperature Coefficient (PTC) heating components are taking the place of the traditional metal ones because of their safety and ability to work steadily on a constant temperature and have a broad application prospect in automotive air conditioning and other fields. However, as the adhesive commonly used in PTC heating components packaging, organic silicon adhesive has a very low thermal conductivity coefficient, which leads to poor heat dissipation capability of package structure. It also adversely affects the power and life of heating components, so the research on thermal management of PTC heating components package structure is necessary. In this paper, the temperature distribution was simulated based on COMSOL Multiphysics, a simulation software, and the influence on heat dissipation capability of various factors were researched. By comparing temperature distribution graph, the influence of different BaTiO₃ arrays, the thickness of adhesive, the thermal conductivity coefficient of adhesive and cooling conditions on heat dissipation capability of PTC heating components package structure were researched. The results showed that compared with 9×1 array, 3×3 array could improve the heat dissipation capability. Besides, higher thermal conductivity and lower thickness of adhesive and faster flow rate of cooling liquid were also profitable to heating dissipation while the temperature of cooling liquid has no significant influence on heat dissipation. Combined with theory analysis, solutions were proposed to improve heat dissipation capability of PTC heating components package structure. The BaTiO₃ ceramic 9×1 array is replaced by a 3×3 array, and adhesive with higher thermal conductivity is used, the thickness of the adhesive is reduced and the flow rate of the cooling liquid is reduced. The new scheme can improve the heat dissipation capacity of the package structure, thus increasing the power and lifetime of the heating element.

Key words: PTCcomponent, electronicpackaging, heatdissipationcapability, softwaresimulation, heatingpower