中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (2): 020202 . doi: 10.16257/j.cnki.1681-1070.2021.0206

• 封装、组装与测试 • 上一篇    下一篇

引线框架塑封集成电路冲切过程中的检测和防护

付小青   

  1. 铜陵三佳山田科技股份有限公司,安徽 铜陵 244000
  • 收稿日期:2020-06-18 出版日期:2021-02-24 发布日期:2020-09-14
  • 作者简介:付小青(1980—),女,安徽合肥人,本科,工程师,现从事半导体工业自动化模具设计工作。

Detection and Protection of IC’sTrim/Form system

FU Xiaoqing   

  1. Tongling Sanjia Yamada Tech. Co.,Ltd, Tongling 244000, China
  • Received:2020-06-18 Online:2021-02-24 Published:2020-09-14

摘要: 在引线框架塑封集成电路的引线冲切成型过程中,存在塑封体破裂脱落、引脚折断等异常现象,如果不能及时发现这些异常,就会造成产品的批量报废或相关成型模具损坏的情况。介绍了如何使用光电传感器和检测针系统对集成电路引脚冲切成型中可能出现的异常进行有效监测和防护。

关键词: 半导体, 检测和防护, 光电传感器, 检测针系统

Abstract: In the process of the integrated circuit's lead trimming&forming, the abnormal things such as tiebar fracture, crack of plastic seal and breakage of lead are appeared. In the production of circuit products, if these anomalies can not be found in time, it will result in mass scrapping of the product and damage to the related T/F equipment. This paper introduces how to use photoelectric sensor and detection pin system to detect and protect the possible anomalies in the trimming and formming of the lead of the integrated circuit.

Key words: semiconductor, detectionandprotection, photoelectricsensor, detectionpinsystem

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