玻璃通孔技术及其可靠性研究现状*

doi:10.16257/j.cnki.1681-1070.2025.0157

摘要/Abstract

摘要： 玻璃通孔（TGV）技术作为三维集成和先进封装的关键技术，以其优异的高频性能、低介电损耗和良好的热机械稳定性，在射频器件、高密度异构集成器件、光电共封装器件等领域展现出广阔的应用前景。然而，TGV技术的可靠性问题仍是制约其大规模产业化的核心挑战之一。系统综述了TGV技术的发展历程、应用研究现状、玻璃转接板制备工艺、可靠性研究进展。着重讨论了TGV关键互连结构由加工、设计、热应力等引起的可靠性问题，在总结常见互连失效机制之后，指出了目前TGV的可靠性研究在多场耦合失效研究、多性能参数协同评估、失效分析手段开发方面的不足。最后针对未来基于TGV技术开发新一代高性能器件的需求，分析了进一步开展可靠性研究工作需要关注的重点，为后续围绕玻璃转接板和TGV技术进行系统性的可靠性研究提供借鉴和参考。

关键词: 玻璃通孔技术, 先进封装, 可靠性研究, 热机械疲劳失效, 电迁移

Abstract: Through glass via (TGV) technology, as a key technology for three-dimensional integration and advanced packaging, demonstrates broad application prospects in radio frequency devices, high-density heterogeneous integration devices, and optoelectronic co-packaged devices, owing to its excellent high-frequency performance, low dielectric loss, and superior thermomechanical stability. However, reliability issues with TGV technology remain one of the core challenges hindering the large-scale industrialization. The development history of TGV technology, its current application research status, the fabrication processes of glass interposers, and recent advancements in reliability studies are systematically reviewed. The reliability problems of key TGV interconnect structures caused by processing, design, and thermal stress are particularly discussed. After summarizing common interconnect failure mechanisms, the current shortcomings are highlighted in TGV reliability research, including studies on multi-field coupled failures, collaborative evaluation of multiple performance parameters, and the development of failure analysis methods. In response to the demand for developing next-generation high-performance devices based on TGV technology, key areas requiring further attention in future reliability research are analyzed. Insights and references for subsequent systematic reliability studies on glass interposers and TGV technology are provided.

Key words: through glass via technology, advanced packaging, reliability research, thermalmechanical induced failure, electrical migration

中图分类号:

TN305.94

马丙戌，王浩中，钟祥祥，向峻杉，刘沛江，周斌，杨晓锋. 玻璃通孔技术及其可靠性研究现状^*[J]. 电子与封装, 2025, 25(7): 070106 .

MA Bingxu，WANG Haozhong, ZHONG Xiangxiang, XIANG Junshan, LIU Peijiang, ZHOU Bin, YANG Xiaofeng. Research Status of Through Glass Via Technology and Its Reliability[J]. Electronics & Packaging, 2025, 25(7): 070106 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

玻璃通孔技术及其可靠性研究现状^*

Research Status of Through Glass Via Technology and Its Reliability

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