关键词: 多层陶瓷电容器, 电-热应力击穿, 失效分析, 可靠性提升, 氧空位迁移

Abstract: To address the electrical-thermal stress breakdown failure of Multilayer Ceramic Capacitor (MLCC), this study systematically analyzes their failure modes. mechanisms and analytical technologies, also proposes reliability improvement solutions. By comprehensively applying electrical performance testing, metallographic microscope observation and electrical screening, combined with grinding and dissection analysis, the internal hidden short-circuit defects and their distribution characteristics are accurately identified. The research reveals that electrical-thermal stress breakdown is mainly manifested as insulation performance degradation caused by "dielectric layer ion migration" and "oxygen vacancy enrichment". Particularly, ultra-thin MLCC with a dielectric layer thickness of ≤0.6 μm exhibit a significantly increased failure risk under high-temperature and high-voltage environments. The failure rate of MLCC can be effectively reduced through measures such as "improving core manufacturing processes", "optimizing circuit design", and "introducing flexible terminal electrode structures". Case verification shows that the introduction of flexible terminal electrode structures and heat dissipation design of printed circuit board（PCB） can reduce the failure rate of conventional MLCC from 0.5% to 0.01% in high-temperature environments.  This study provides an effective methodological system for failure analysis of MLCC in high-reliability fields and holds guiding significance for the optimization of intelligent manufacturing processes.

Key words: multilayer ceramic capacitor (MLCC), electrical-thermal stress breakdown, failure analysis, reliability improvement, oxygen vacancy migration