中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装

• 封装、组装与测试 •    下一篇

脱模剂对基板类单面封装质量及塑封料关键性能的影响

蔡晓东,周凯   

  1. 上海道宜半导体材料有限公司,上海  201400
  • 收稿日期:2026-01-06 修回日期:2026-01-22 出版日期:2026-01-28 发布日期:2026-01-28
  • 通讯作者: 蔡晓东

Effect of Release Agents on the Quality of Single-Sided Encapsulation for Substrates and Key Properties of Epoxy Molding Compound

CAI Xiaodong, ZHOU Kai   

  1. DOITECH Semiconductor Advanced Materials Co., Ltd., Shanghai 20140
  • Received:2026-01-06 Revised:2026-01-22 Online:2026-01-28 Published:2026-01-28

摘要: 为优化基板类单面封装用环氧塑封料的外观质量与连续作业性,研究天然蜡A与合成蜡B两种脱模剂及其复配体系对塑封料基本理化性能和脱模力的影响。采用实验设计,设置3组方案,通过凝胶化时间、螺旋流动长度、熔融黏度、脱模力测试及圆盘模拟、单面封装连续作业性验证,系统分析脱模剂类型对塑封料关键性能的作用规律。结果表明:三种体系对凝胶化时间影响无显著差异;天然蜡A可降低塑封料熔融黏度、提升流动性并减小脱模力,但易导致外观流痕;合成蜡B流动性与脱模效果稍差;1:1复配体系综合性能最优,兼顾良好流动性、无外观缺陷,连续作业性优异。该研究为基板类单面封装用塑封料的脱模剂体系设计提供技术支撑。

关键词: 环氧塑封料, 脱模剂, 基板类单面封装, 连续作业性, 外观质量

Abstract: To optimize the appearance quality and continuous processing performance of epoxy molding compounds for single-sided encapsulation of substrates, this study investigates the effects of two release agents-natural wax A and synthetic wax B-and their blended systems on the fundamental physicochemical properties and release force of the molding compound. Using experimental design with three schemes, the effects of release agent types on key molding compound properties were systematically analyzed through gelation time, spiral flow length, melt viscosity, release force testing, disc simulation, and single-sided encapsulation continuous operation verification. Results indicate: Natural wax A reduced the plastic encapsulant's melt viscosity, improved flowability, and decreased demolding force, but tended to cause surface flow marks; synthetic wax B exhibited slightly poorer flowability and demolding performance; the 1:1 blend system demonstrated the best overall performance, balancing good flowability, no surface defects, and excellent continuous operation. This study provides technical support for the design of demolding agent systems for plastic encapsulants used in single-sided encapsulation of substrates.

Key words: epoxy molding compound, release agent, single-sided encapsulation of substrates, continuous operation, appearance quality