中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

导航

电子与封装

• 封装、组装与测试 •    下一篇

陶瓷封装中生瓷粘附强度测试及结合胶开发

陈杨,关叶青,孙博,孙乐   

  1. 中国电子科技集团公司第五十五研究所,南京  210016
  • 收稿日期:2026-06-21 修回日期:2026-07-07 出版日期:2026-07-14 发布日期:2026-07-14
  • 通讯作者: 陈杨

Test Method and Adhesive Development for Green Ceramic Adhesion in Ceramic Package

CHEN Yang, GUAN Yeqing, SUN Bo, SUN Le   

  1. The 55th Institute of China Electronics Technology Group Corporation, Nanjing 210016, China
  • Received:2026-06-21 Revised:2026-07-07 Online:2026-07-14 Published:2026-07-14

摘要: 针对陶瓷封装外壳制造过程中生瓷层间粘附强度难以量化评估,以及结合胶材料稳定性不足的问题,提出了一种基于拉伸剪切试验的生瓷粘附强度测试方法。通过设计夹具与试样结构,解决了生瓷测试样品易变形、界面应力分布不均匀的问题,实现了生瓷加工阶段层间粘附强度的定量表征。同时,对结合胶进行材料配方上的优化,在材料配方中引入极性小分子增容剂,改善生瓷层间的粘附强度,基于定量测试方法表明优化后的结合胶使生瓷粘附强度提升近3倍,有效降低了生瓷加工和高温烧结过程中的层间剥离缺陷。该研究为陶瓷封装外壳的工艺质量控制提供了关键技术支撑,对提升器件的气密性与长期稳定性具有重要意义。

关键词: 陶瓷封装, 生瓷粘附强度, 测试方法, 结合胶

Abstract: To address the challenges of quantitatively assessing interlayer adhesion strength in green ceramic tapes during ceramic package manufacturing and the insufficient stability of bonding adhesives, this study proposes a tensile shear testing method for evaluating green ceramic adhesion. By designing specialized fixtures and specimen structures, the issues of sample deformation and non-uniform interfacial stress distribution inherent to green ceramic testing were resolved, enabling quantitative characterization of interlayer adhesion strength during processing. Additionally, the bonding adhesive formulation was optimized by incorporating a polar small-molecule compatibilizer, which significantly enhanced interlayer adhesion. Quantitative testing demonstrated that the optimized adhesive improved green ceramic adhesion strength by nearly threefold, effectively reducing delamination defects during both machining and high-temperature sintering. This research provides critical technical support for process quality control in ceramic packaging, contributing substantially to improved device hermeticity and long-term reliability.

Key words: ceramic package, green ceramic adhesion strength, test method, bonding adhesive