关键词: 针压, 接触电阻, 测试

Abstract: There are large current test items in the test test of the wafer, such as the test of the reference voltage. It will be affected by the contact resistance. The contact resistance will raise the zero point of the simulated ground in the test loop too much, resulting in the test base voltage being larger than the true value. large. Similar to the above description, the chip that is greatly affected by the size of the needle pressure during the test of the round film is a needle pressure sensitive chip; Such chips generally need to increase the pressure of the probe needle during the test process or continuously clean the needle and grind the needle during the test process to reduce the contact resistance, thereby reducing the test error. However, constantly clearing needles and grinding needles will cause irreparable damage to the probe and shorten the service life of the probe. Therefore, it is very important to find a method to solve the impact of needle pressure on testing voltage.

Key words: acupressure, contact resistance, test